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Performance research of a semiconductor cooling device with solid desiccant.

[In Chinese. / En chinois.]

Author(s) : ZHENG Y., LIU X. H., TU R.

Type of article: Article

Summary

Semiconductor refrigeration, known as thermoelectric refrigeration, is applied widely in fields such as industrial production and daily life, due to the advantages of rapid cooling and easy control. The heat disposition on the hot side is the principle element restricting the coefficient of semiconductor refrigeration. In a conventional device, dehumidification is achieved thanks to condensing dehumidification method, which lowers the temperature of the cold side of semiconductor and hence restricts the system COP. The semiconductor refrigeration model with heat pipe and solid desiccant is built in this paper, and verified by the experimental results of a 6-stage semiconductor refrigeration equipment with heat pipes. Then the model is used to predict the cooling and dehumidification performances with solid desiccant. The COP of the proposed semiconductor refrigeration system is 1.78, which is higher than shown in literature with condensing dehumidification under the same dehumidification amount.

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Pages: 59-64

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