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SIMULTANEOUS MEASUREMENT OF THE THERMAL CONDUCTIVITY AND DIFFUSIVITY OF SMALL SIZE ELEMENTS: APPLICATION TO THE CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGE SAMPLES.

Author(s) : SCUDELLER Y., BARDON J. P.

Type of article: Article

Summary

A NEW METHOD FOR THE SIMULTANEOUS MEASUREMENT OF THERMAL CONDUCTIVITY AND DIFFUSIVITY, BASED ON THE ANALYSIS OF THE AMOUNT OF HEAT WHICH PENETRATES A SAMPLE, HAS BEEN SET UP. TWO METROLOGICAL SYSTEMS FOR INTEGRATED CIRCUIT PACKAGE SAMPLES HAVE BEEN MINIATURIZED. THE FIRST CONCERNS RESIN SAMPLES AND THE OTHER CERAMIC SAMPLES. A SENSITIVITY ANALYSIS HAS LED TO THE OPTIMIZATION OF THE PROCESS.

Details

  • Original title: SIMULTANEOUS MEASUREMENT OF THE THERMAL CONDUCTIVITY AND DIFFUSIVITY OF SMALL SIZE ELEMENTS: APPLICATION TO THE CHARACTERIZATION OF INTEGRATED CIRCUIT PACKAGE SAMPLES.
  • Record ID : 1991-2517
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 34 - n. 3
  • Publication date: 1991/03

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