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Transient heat transfer in channel of liquid or supercritical helium.

Author(s) : KINGSBURY D. L., SCIVER S. W. van

Type of article: Article

Summary

Thin-film temperature sensors fabricated on alumina chips have been used. Steady-state behaviour suggests that at low powers (in the nucleate boiling regime) only the sensor surface (about 9% of the whole chip face) is heated, and at high powers (in the film boiling regime) the entire chip face is heated; intermediate powers produce large thermal fluctuations, probably corresponding to fluctuations in the extension of the helium film. It is conjectured that the redistribution of heat flow during the onset of film boiling accounts for the comparatively gradual "take-off" observed in the heat pulse temperature responses.

Details

  • Original title: Transient heat transfer in channel of liquid or supercritical helium.
  • Record ID : 1996-3221
  • Languages: English
  • Source: Cryogenics - vol. 35 - n. 9
  • Publication date: 1995/09

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