For IIR members only

Briefs: Chip cooling innovations

IBM researchers demonstrated a prototype that integrates a computer chip cooling system into 3-dimensional stacks by piping water directly between each layer in a chip stack. These so-called 3D chip stacks, which take chips and memory devices that traditionally sit side-by-side on a silicone wafer a...

IIR members only

You must be an IIR member to read the rest of this article.

Members benefit from exclusive advantages and services.

To find out more, please click on the link below:

Already a member?