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The challenges of thermal management of next-generation electronic equipment
With the increasing integration and miniaturization of electronic devices, the heat flows they generate are constantly increasing. Spray cooling has many advantages in this regard.
The Chinese and Greek authors of a recent review paper (1) stress that electronic chips are the most important components for the development of technologies such as the Internet, artificial intelligence, supercomputers, etc. To enable high performance and high integration, the power density of e...
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