Share

A simplified transient three-dimensional model for estimating the thermal performance of the vapour chambers.

Author(s) : CHEN Y. S., CHIEN K. H., WANG C. C., et al.

Type of article: Article

Summary

The vapour chambers (flat plate heat pipes) have been applied on the electronic cooling recently. To satisfy the quick-response requirement of the industries, a simplified transient three-dimensional linear model has been developed and tested in this study. In the proposed model, the vapour is assumed as a single interface between the evaporator and condenser wicks, and this assumption enables the vapour chamber to be analyzed by being split into small control volumes. Comparing with the previous available results, the calculated transient responses have shown good agreements with the existing results. For further validation of the proposed model, a water-cooling experiment was conducted. In addition to the vapour chamber, the heating block is also taken into account in the simulation. It is found that the inclusion of the capacitance of heating block shows a better agreement with the measurement. [Reprinted with permission from Elsevier. Copyright, 2006].

Details

  • Original title: A simplified transient three-dimensional model for estimating the thermal performance of the vapour chambers.
  • Record ID : 2007-0574
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 26 - n. 17-18
  • Publication date: 2006/12

Links


See other articles in this issue (13)
See the source

Indexing