An experimental method to determine the contact thermal resistance of PCM materials undergoing large volume change.
Number: 2571
Author(s) : RENDALL J., SHEN Z., SHRESTHA S., GEHL T., ATCHLEY J.
Summary
Contact resistance between heat exchangers and phase change materials (PCMs) influences the overall thermal conductivity of thermal energy storage system (TES) and cannot be ignored when PCMs experience large volume changes during phase change. In this paper, a heat flow meter apparatus (HFMA) was modified to measure the contact pressure throughout the phase change process to determine the impact of this volume change. First, resistive based pressure sensors were added to the HFMA. Second, the heat flow measurements from the HFMA were used to determine the overall resistance for a baseline case without a PCM sample and to control for any temperature based effects. Third, a PCM sample was added, and the thermal contact conductivity reported as the temperature was swept in the HFMA. Finally, with all noise cleaned, a state of charge (SOC) vs. resistance reading relationship was developed. The results shown that a HFMA with the addition of a pressure measurement can determine the contact resistance and SOC of a PCM material. These results suggests that SOC models can be developed for various materials in the modified HFMA. Then, when the PCM is deployed a simple pressure sensor or deflection sensor on an expansion bladder can be used to give real time SOC information in the field. These types of pressure based sensors are advantageous as the current state of the art sensors are temperature measurements, which are only a local measurement. The pressure type measurement allows for a bulk reading of SOC. Also, when a PCM store with an expansion tank allows for insuring large enough contact pressure.
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- Original title: An experimental method to determine the contact thermal resistance of PCM materials undergoing large volume change.
- Record ID : 30030775
- Languages: English
- Subject: Technology
- Source: 2022 Purdue Conferences. 19th International Refrigeration and Air-Conditioning Conference at Purdue.
- Publication date: 2022
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