Analysis of a platform for thermal management studies of microelectronics cooling methods.
Author(s) : TIGNER J., MOEINI SEDEH M., SHARPE T., et al.
Type of article: Article
Summary
This study describes the demonstration and analysis of a platform for thermal management studies of microelectronics cooling methods. The platform consists of an aluminum base with a heater cartridge inserted to simulate the microelectronics heat source. Over the last decade, several promising methods for next-generation cooling of microelectronics have been proposed and studied using various testing platforms. However, it is difficult to compare results obtained for different platforms. The platform presented in this study is applicable for testing several different cooling methods thereby eliminating the difficulty in comparing results across methods. In this study, the platform was first demonstrated for testing of phase-change materials as a cooling method for microelectronics. Then, results obtained from the demonstration guided further analysis of the platform using experimental, analytical and computational approaches. The results of the analysis indicated the applicability of a lumped parameter model for platforms of the type presented in this study. Furthermore, the results quantified the applicability of the zero flux boundary condition often assumed for thermal-management studies and also showed that, as the area of the insulated portion of the platform increases, the thermal response time increases due to the decrease in the surface area for heat transfer. Finally, overall, the study confirms the utility of the platform for thermal management studies and provides insight into its performance.
Details
- Original title: Analysis of a platform for thermal management studies of microelectronics cooling methods.
- Record ID : 30008378
- Languages: English
- Source: Applied Thermal Engineering - vol. 60 - n. 1-2
- Publication date: 2013/10
- DOI: http://dx.doi.org/10.1016/j.applthermaleng.2013.06.042
Links
See other articles in this issue (10)
See the source
Indexing
-
Numerical simulation of three-dimensional trans...
- Author(s) : YANG Y. T., WANG Y. H.
- Date : 2012/01
- Languages : English
- Source: International Journal of thermal Sciences - vol. 51
View record
-
Experimental and numerical studies on performan...
- Author(s) : HOSSEINIZADEH S. F., TAN F. L., MOOSANIA S. M.
- Date : 2011/12
- Languages : English
- Source: Applied Thermal Engineering - vol. 31 - n. 17-18
View record
-
Performance assessment of regularly structured ...
- Author(s) : LOHSE E., SCHMITZ G.
- Date : 2012/06
- Languages : English
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 35 - n. 4
- Formats : PDF
View record
-
Impact of shape of container on natural convect...
- Author(s) : OMARI K. el, KOUSKSOU T., LE GUER Y.
- Date : 2011/10
- Languages : English
- Source: Applied Thermal Engineering - vol. 31 - n. 14-15
View record
-
Experimental investigation of temporary electro...
- Author(s) : LOHSE E., SCHMITZ G.
- Date : 2012/07/16
- Languages : English
- Source: 2012 Purdue Conferences. 14th International Refrigeration and Air-Conditioning Conference at Purdue.
- Formats : PDF
View record