Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules.
Author(s) : JUBRAN B. A., SWIETY S. A., HAMDAN M. A.
Type of article: Article
Summary
It was found that using different sizes or shapes of modules in an array configuration tends to increase the Nusselt number by as much as 40% for the rectangular module and 28% for the cylindrical module. A missing module in the array resulted in a 37% enhancement in the Nusselt number downstream the missing module. Pressure drop results indicate that large size modules tend to enhance the pressure drop at their row locations by as much as 15 %, while the cylindrical module tends to attenuate the pressure drop especially at low Reynolds number.
Details
- Original title: Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules.
- Record ID : 1997-1396
- Languages: English
- Source: International Journal of Heat and Mass Transfer - vol. 39 - n. 16
- Publication date: 1996/11
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Indexing
- Themes: Mass transfer
- Keywords: Geometry; Electronics; Calculation; Heat transfer; Cooling; Simulation; Pressure drop
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