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Cooling unit for computer chip by using boiling heat transfer.

[In Japanese. / En japonais.]

Author(s) : KAWAGUCHI K., TERAO T., KOBAYASHI K.

Type of article: Article

Summary

In recent years, the heating value of CPU has been increasing rapidly in proportion to the improvement of computer performance. Therefore, the computer industry requires new cooling units with a high cooling performance for CPU adaptable to high heating value and high heat flux. In the past the cooling unit for CPU was used with air-cooling aluminium fins, but it could not be adapted to high heating values. The authors developed a new compact boiling refrigerant type cooling unit for CPU with a high cooling performance in comparison with the air-cooling aluminium fin. The paper describes the cooling performance and pressure drop characteristics of the boiling refrigerant type cooling unit for CPU. The characteristics were clarified by testing the cooling unit under various test conditions, which were different Reynolds number, various sizes of cooling unit and various inclination angles. Furthermore these being equations to predict cooling performance and pressure drop in the cooling unit are proposed.

Details

  • Original title: [In Japanese. / En japonais.]
  • Record ID : 2005-2839
  • Languages: Japanese
  • Source: Transactions of the Japan Society of Refrigerating and Air Conditioning Engineers - vol. 21 - n. 4
  • Publication date: 2004

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