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Micro cooling systems for high density packaging.

Author(s) : GROMOLL B.

Type of article: Article

Summary

Future 3D electronics packaging systems will require micro cooling systems, that can be integrated and permit the continued use of air as a coolant. To achieve this, new types of silicon micro heat exchangers were made using an anisotropic etching process. They can be used either as a heat exchanger for direct cooling with compressed air or as a heat pipe and thermosiphon for indirect cooling with fan-blown air. The performance characteristics of the various cooling systems are stated.

Details

  • Original title: Micro cooling systems for high density packaging.
  • Record ID : 1999-3236
  • Languages: English
  • Source: Rev. gén. Therm. - vol. 37 - n. 9
  • Publication date: 1998/10

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