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Experimental comparison of different composite latent heat storage devices with spatially non-constant heat loads.

Number: pap. 2170

Author(s) : VEELKEN H., SCHMITZ G.

Summary

This paper presents experimental results of five composite latent heat storage (CLHS)test heatsinks (HS1-HS5) for electronic components with non-constant heat loads (including so called hot spots). The first two heatsinks are pure aluminum (HS1) and pure phase change material (PCM) (HS2) and are used as references. The third heatsink (HS3) is constructed with straight aluminum fins, while the fourth (HS4) and fifth (HS5) are constructed with a heat load dependent procedure and are therefore customized heatsinks. HS5 is optimized compared to HS4. The PCM used in this study is Parafol® 22-95. The heatsinks are cubes with boundary edge lengths of 10cm. Below the heatsinks 5 copper stripes are installed, that can realize independent heat loads of 0 W to 120 W. The experimental time is 2400s and the temperature at the contact surface to the electronic is monitored with 30 thermocouples (20 aligned in the center of the heat sink, 10 aligned at the boundary). The compared quantity is the surface averaged temperature at the contact surface at the time t=2400s. Measurements are qualitatively compared to simulations and differences between measurements and simulations are discussed. The results show an improved performance of the customized heat sinks of 0:5 K compared to the straight fin heat sink (HS3). Undergoing Measurements indicate, the higher the differences between the copper stripes are chosen and the more optimization parameters are chosen the larger the improvement compared to HS3 is. For a different heat load the improvement, that was measured is 1:9 K.

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Pages: 10 p.

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Details

  • Original title: Experimental comparison of different composite latent heat storage devices with spatially non-constant heat loads.
  • Record ID : 30019006
  • Languages: English
  • Source: 2016 Purdue Conferences. 16th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Publication date: 2016/07/11

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