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Experimental investigation of additively manufactured microchannel evaporator performance using low-GWP refrigerants compared to conventional air cooling in electronics cooling.

Number: 2324

Author(s) : KRAMER T., LEMBERG K., BARTA R. B., RADDATZ M., HESSE U.

Summary

With the increasing electrification of power systems, the need for efficient energy conversion systems and hereby power electronics increases correspondingly. Power semiconductor devices such as diodes, power transistors, or thyristors enable an efficient conversion or switching of electricity from a few milliwatts up to nearly a gigawatt. Typical power semiconductor devices include components from the group of MOSFET (Metal Oxide Semiconductor Field Effect Transistor), GTO- (Gate Turn Off-) Thyristors, IGCT (Integrated Gate Commutated Thyristor), power diodes and especially IGBT (Insulated Gate Bipolar Transistor). These Semiconductor components are decreasing in size while increasing in power and capacity. Therefore, novel efficient cooling strategies are growing in importance and relevance. Until now over 95 % of industrial applications from the stationary and mobile sectors use cooling concepts based on conventional air or liquid cooling. Although liquid and air cooling are already quite developed and tested, two-phase cooling could increase the heat transfer coefficient as well as the amount of heat absorbed, and could therefore help cooling semiconductor components with their associated increasing power and decreasing size. In this paper, the potential of evaporative cooling in microchannel heat exchangers for power electronics cooling applications is examined. It is shown that, through the usage of additively manufactured microchannel heat exchangers instead of conventional air cooling, the absorbed heat flux can be more than doubled.

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  • Original title: Experimental investigation of additively manufactured microchannel evaporator performance using low-GWP refrigerants compared to conventional air cooling in electronics cooling.
  • Record ID : 30030658
  • Languages: English
  • Subject: Technology
  • Source: 2022 Purdue Conferences. 19th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Publication date: 2022

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