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Experimental investigations on cooling with heat pipe in electronics applications.

Number: 17798

Author(s) : ATILLA B., BIROL K., MERT S., MALIK C.

Summary

Reliable cooling of high-performance CPUs is a key requirement for modern computing systems operating under high and variable thermal loads. This study experimentally compares an enhanced three-phase heat pipe (3PHP) cooling solution with a commercially available market-standard system (MARKET) for practical electronics cooling applications. Tests were conducted at input powers of 200 W, 300 W, and 400 W, representing typical to extreme CPU operating conditions in data centers and high-performance computing platforms. System performance was evaluated based on temperature uniformity, thermal resistance, heat removal capability, and stabilization time using a purpose-built test rig with real-time temperature monitoring. The 3PHP system demonstrated consistently lower operating temperatures and faster thermal stabilization across all power levels. At 400 W, the MARKET solution approached thermal saturation, while the 3PHP maintained stable operation. The results indicate that advanced heat pipe configurations can significantly enhance cooling reliability and thermal margins in high-power-density electronic systems, supporting their integration into next-generation CPU and data-center cooling architectures.

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Pages: 12 p.

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Details

  • Original title: Experimental investigations on cooling with heat pipe in electronics applications.
  • Record ID : 30034709
  • Languages: English
  • Subject: Technology
  • Source: 9th IIR International Conference on Sustainability and the Cold Chain. Proceedings: April 12-14 2026
  • Publication date: 2026/04
  • DOI: http://dx.doi.org/10.18462/iir.iccc.2026.7798

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