Share

Forced convective air-cooling of simulated printed-circuit boards.

Author(s) : TAM W. C., LEUNG C. W.

Type of article: Article

Summary

The considered assembly consisted of a simulated printed-circuit board, in this instance a horizontal, thermally insulating base with uniformly spaced rectangular copper bars (hereafter referred to as ribs, used to mimic the behaviour of electronic components) protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated printed-circuit board; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured.

Details

  • Original title: Forced convective air-cooling of simulated printed-circuit boards.
  • Record ID : 1994-3217
  • Languages: English
  • Source: Appl. Energy - vol. 46 - n. 3
  • Publication date: 1993

Links


See the source

Indexing