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Free convection limits for pin-fin cooling.

Author(s) : FISHER T. S., TORRANCE K. E.

Type of article: Article

Summary

Heating from high-power electronic components can cause large increases in device and coolant temperatures. Often, components are cooled by mechanical fans or by other active devices. However, in many applications, active cooling may be undesirable due to power consumption, excessive noise, or reliability concerns. For some designs, it may be possible to exploit the buoyant forces created by fluid heating in order to cool electronic devices, and an understanding of the limits of free convection is necessary to design such systems. The study uses analytical methods to predict the upper limits of heat transfer from pin-fin heat-sink/chimney systems.

Details

  • Original title: Free convection limits for pin-fin cooling.
  • Record ID : 1999-3447
  • Languages: English
  • Source: J. Heat Transf. - vol. 120 - n. 3
  • Publication date: 1998/08
  • Document available for consultation in the library of the IIR headquarters only.

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