ShareA new model for heat transfer of fins swinging back and forth in a flow.
Author(s) : FU W. S., YANG S. J.
Type of article: Article
Summary
In this paper, a new concept of an electronic device cooling method is proposed. In this method, extremely thin fins are used for swinging back and forth in a flowing fluid. The boundary layers attaching on the fins are then contracted and disturbed, and the heat transfer rate of the fins can be enhanced remarkably.
Details
- Original title: A new model for heat transfer of fins swinging back and forth in a flow.
- Record ID : 2002-1259
- Languages: English
- Source: International Journal of Heat and Mass Transfer - vol. 44 - n. 9
- Publication date: 2001/05
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Indexing
- Themes: Heat transfer
- Keywords: Fin; Electronics; Heat transfer; Design; Cooling; Modelling; Component
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