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IMMERSION COOLING OF ELECTRONICS IN FLUIDIZED BEDS OF DIELECTRIC PARTICLES.

Author(s) : BROWN R. C., JASPER S. S.

Type of article: Article

Summary

THE FLUIDIZED BEDS SHARE SEVERAL OF THE ATTRACTIVE QUALITIES OF DIELECTRIC LIQUIDS BUT EMPLOY AIR RATHER THAN LIQUIDS IN THEIR OPERATION. EXPERIMENTS IN COOLING ELECTRONIC CIRCUIT BOARDS BY DIRECTLY IMMERSING THEM IN FLUIDIZED BEDS OF DIELECTRIC PARTICLES HAVE BEEN PERFORMED. HEAT DISSIPATION FROM A SIMULATED 20-PIN FLAT PACK WAS A FACTOR OF 8 GREATER THAN FORCED CONVECTION WITHOUT PARTICLES. IN DESIGNS WHERE HEAT CONDUCTION FROM THE COMPONENT TO THE CIRCUIT BOARD IS SEVERELY LIMITED, ENHANCEMENTS APPROACHING A FACTOR OF 50 ARE EXPECTED.

Details

  • Original title: IMMERSION COOLING OF ELECTRONICS IN FLUIDIZED BEDS OF DIELECTRIC PARTICLES.
  • Record ID : 1990-0399
  • Languages: English
  • Source: Heat Transf. Eng. - vol. 10 - n. 3
  • Publication date: 1989
  • Document available for consultation in the library of the IIR headquarters only.

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