Summary
The temperature control precision is crucial for the sensitive elements in a spacecraft. In the present study, a temperature control system to improve the performance of spacecraft precision instruments was designed and experimentally investigated. In the temperature control system, heat pipes, high emissivity coatings, and semiconductor coolers are applied to dissipate the internal heat and control the temperature of a sensitive element. Heat pipes are arranged on the sensitive element and the innermost shell, high radiation coatings are sprayed on each shell surface to transfer the heat to the outer layer, and semiconductor coolers are mounted on the outermost shell and dissipate heat to the external environment. The temperature of the sensitive element is compensated by an electric heating device to reduce the temperature fluctuations. A digital-analog control scheme was designed to maintain the temperature of the outer shell and the sensitive component of the temperature control system. The control accuracy of the temperature control system is within ±0.1 ℃ under different working conditions. When the frequency point is at 0.089928 Hz, the signal amplitude of temperature is taken as the maximum value of 5.05 mK; the amplitude spectral density is 0.006 ∼ 9 mK/Hz1/2 in the frequency range 0.001 ∼ 0.25 Hz.
Available documents
Format PDF
Pages: 462-470
Available
Public price
20 €
Member price*
Free
* Best rate depending on membership category (see the detailed benefits of individual and corporate memberships).
Details
- Original title: Design and thermal characteristic test of a temperature control system for spacecraft precision instrument.
- Record ID : 30030925
- Languages: English
- Subject: Technology
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 146
- Publication date: 2023/02
- DOI: http://dx.doi.org/10.1016/j.ijrefrig.2022.12.007
Links
See other articles in this issue (41)
See the source
Indexing
- Themes: Other industrial applications
- Keywords: Aerospace application; Expérimentation; Heat pipe; Design; Accuracy; Electronic component; Temperature
-
Embedded microheating elements in polymeric mic...
- Author(s) : GAITAN M., LOCASCIO L. E.
- Date : 2004/05
- Languages : English
- Source: J. Res. NIST - vol. 109 - n. 3
View record
-
Thermomechanical issues in electronic packaging...
- Author(s) : BEYNE E., VANDEVELDE P., CHRISTIAENS F.
- Date : 1997/10/24
- Languages : English
- Source: Thermal management of electronic systems III. Proceedings of the EUROTHERM Seminar 58.
View record
-
Parametric design of a cooler for a micro-proce...
- Author(s) : CONSOLINI L., THOME J. R.
- Date : 2005/08/02
- Languages : English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Formats : PDF
View record
-
Mini-tubes to cool electronic chips.
- Date : 1995
- Languages : English
- Source: New Sci. - vol. 145
View record
-
Passive Thermal Control Design Methods, Analysi...
- Author(s) : SELVADURAI S., CHANDRAN A., VALENTINI D., LAMPRECHT B.
- Date : 2022/03
- Languages : English
- Source: Applied Sciences - vol. 12 - n. 6
- Formats : PDF
View record