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Micro thermoelectric cooler: planar multistage.

Author(s) : HWANG G. S., GROSS A. J., KIM H., et al.

Type of article: Article

Summary

A suspended, planar multistage micro thermoelectric (TE) cooler is designed using thermal network model to cool MEMS devices. Though the planar (two-dimensional) design is compatible with MEMS fabrication, its cooling performance is reduced compared to that of a pyramid (three-dimensional) design, due to a mechanically indispensable thin dielectric substrate (SiO2) and technical limit on TE film thickness. We optimize the planar, six-stage TE cooler for maximum cooling, and predict DeltaTmax = 51 K with power consumption of 68mW using undoped, patterned 4-10 micro-m thick co-evaporated Bi(2)Te(3) and Sb(2)Te(3) films. Improvement steps of the planar design for achieving cooling performance of the ideal pyramid design are discussed. The predicted performance of a fabricated prototype is compared with experimental results with good agreements. [Reprinted with permission from Elsevier. Copyright, 2008].

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