Patents alert: refrigeration cooling device with a solid sorbent.
Author(s) : SMITH D., RODERICK K., BRAUN R.
Type of article: Article
Summary
This article describes the following: a liquid refrigerant reservoir and a cooling device comprised of at least one sorbent section, at least one liquid passageway section, at least one wicking material, at least one thermal spacer, a vapour-permeable membrane, a heat-removing material, at least one liquid barrier, a liquid refrigerant reservoir, and a valve. The sorbent section contains a sorbent for a liquid refrigerant. The liquid passageway section is adjacent to the sorbent section and defines a liquid passageway through a portion of the evacuated sorbent assembly and cooling device to the sorbent section. The wicking material is disposed in the liquid passageway section. The thermal spacer is in contact with the sorbent section. The vapour-permeable membrane is interposed between the liquid passageway section and the thermal spacer. The heat-removing material is in thermal contact with the sorbent. The liquid barrier is interposed between the heat-removing material and the sorbent. The liquid refrigerant reservoir is adjacent to the liquid passageway section. The valve controls liquid communication between the liquid passageway section and the liquid refrigerant reservoir. The cooling device includes a casing that surrounds the sorbent section, liquid passageway section, wicking material, thermal spacer, vapour-permeable membrane, heat-removing material, liquid barrier, liquid refrigerant reservoir, and valve.
Details
- Original title: Patents alert: refrigeration cooling device with a solid sorbent.
- Record ID : 2004-2226
- Languages: English
- Source: Applied Thermal Engineering - vol. 23 - n. 18
- Publication date: 2003/12
Links
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Indexing
- Themes: Absorption and adsorption systems
- Keywords: Refrigerating system; Patent; Adsorber
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- Date : 2003/12
- Languages : English
- Source: Applied Thermal Engineering - vol. 23 - n. 18
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- Date : 2002/09/24
- Languages : English
- Source: Proceedings of the International Sorption Heat Pump Conference.
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- Author(s) : LAI H. M.
- Date : 2000/05
- Languages : English
- Source: Applied Thermal Engineering - vol. 20 - n. 7
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- Author(s) : ZHAO Y. J., WANG R. Z., WANG L. W.
- Date : 2014/03/02
- Languages : English
- Source: International sorption heat pump conference (ISHPC2014), College Park, United States, March 31-April 2, 2014.
- Formats : PDF
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