Plate-fin array cooling using a finger-like piezoelectric fan.
Author(s) : SHYU J. C., SYU J. Z.
Type of article: Article
Summary
In this study, the heat transfer of a plate-fin array cooled by a vibrating finger-like piezoelectric fan comprising four flexible rectangular blades was investigated. The results indicated that the heat transfer enhancement of the fin array cooled by a vibrating piezoelectric fan at x/L = 0.5 and H = 5 mm ranged between 1.5 and 3.3, regardless of the fin array orientation. However, the heat transfer enhancement caused by a fan being placed at either edge of the fin array yielded a dissimilar result between both of the fin array orientations because of the superimposed effects of the boundary layer development and the air flow induced by the fan. This dissimilarity was especially noticeable when the piezoelectric fan was composed of aluminum blades to accommodate the moderate Reynolds number. In addition to the Reynolds number, the ratio of the fan blade vibration envelope to the source area determined the Nu number of the piezoelectric fan-cooled fin array. This design enhanced the fin array heat transfer and reduced cooler volume by embedding multiple vibrating beams into the fin array.
Details
- Original title: Plate-fin array cooling using a finger-like piezoelectric fan.
- Record ID : 30010278
- Languages: English
- Source: Applied Thermal Engineering - vol. 62 - n. 2
- Publication date: 2014/01
- DOI: http://dx.doi.org/10.1016/j.applthermaleng.2013.10.021
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Indexing
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Themes:
Heat transfer;
Other industrial applications - Keywords: Electronics; Fan; Heat transfer; Design; Reynolds; Cooling; Plate-fin
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