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Investigation of self-similar heat sinks for liquid cooled electronics.

Author(s) : BRIGHENTI F., KAMARUZAMAN N., BRANDNER J. J.

Type of article: Article

Summary

Electronic systems require cooling devices that are able to deal with high heat- flux capabilities. For this purpose, microchannels are attractive for direct cooling, due to their superior performances. A study on self-similar heat sinks for liquid cooled electronics is presented in this work, where the devices are made from copper, designed for industrial application and for large scale production. Self-similarity refers to the fact that there is a certain similarity and repeatability (or pattern) of the substructures compared with the overall structure. The internal structures, the so called over-flow structures (or microchannels), have been designed in order to achieve high heat transfer coefficients. To validate the design and describe the flow characteristics inside the device via analytical solutions is almost impossible; therefore a well-known numerical code was employed to have an insight of the thermal-fluid distributions. As can be seen clearly from the simulation, most of the heat is removed in the over flow-structure, on the side of the device adjacent to the source of heat. This paper attempts to analyze a comprehensive list of data as well as plots in a critical manner in order to illustrate the significant characteristics of this type of device. A clear lack in a proper common definition of the heat flux may lead to a misinterpretation of the results, in fact depending on the chosen area where the heat exchange takes place (namely the internal area of the microstructures or the separation surface between the device and the heating source), we can achieve a maximum heat flux of either about 200 W/cm2 or about 700 W/cm2. A very low pressure drop together with a good heat removal capability, make this device suitable for cooling of IGBT chips in power electronic applications.

Details

  • Original title: Investigation of self-similar heat sinks for liquid cooled electronics.
  • Record ID : 30009161
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 59 - n. 1-2
  • Publication date: 2013/09
  • DOI: http://dx.doi.org/10.1016/j.applthermaleng.2013.01.001

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