Prospects of confined flow boiling in thermal management of microsystems.
Author(s) : LIN S., SEFIANE K., CHRISTY J. R. E.
Type of article: Article
Summary
The paper presents a review of prospects of confined flow boiling in future thermal management of microsystems such as microelectronics, optoelectronics, and microreactors. With the trend towards miniaturisation, heat removal has become the major bottleneck in microsystem development. In view of this, the authors briefly discuss available cooling strategies, then assess studies of confined flow boiling and potential applications in heat dissipation from microsystems.
Details
- Original title: Prospects of confined flow boiling in thermal management of microsystems.
- Record ID : 2002-2867
- Languages: English
- Source: Applied Thermal Engineering - vol. 22 - n. 7
- Publication date: 2002/04
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Indexing
- Themes: Heat transfer
- Keywords: Industrial application; Electronics; Heat transfer; Miniaturization; Flow; Heat exchanger; Boiling
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