Share

Numerical optimization of the thermal performance of a microchannel heat sink.

Author(s) : RYU J. H., CHOI D. H., KIM S. J.

Type of article: Article

Summary

The recent trend in the electronic equipment industry toward denser and more powerful products requires higher thermal performance from a cooling technique. Many innovative cooling methods have been proposed. A microchannel heat sink, as first proposed by Tuckerman and Pease, is based on the idea that the heat transfer coefficient is inversely proportional to the hydraulic diameter of the channel. The purpose of the present study is to develop a three-dimensional analysis procedure and examine the entrance effects on the thermal performance of a microchannel heat sink. The procedure is then incorporated in an optimization scheme to find the optimal design parameters of a microchannel heat sink that minimizes the thermal resistance subject to a specified pumping power.

Details

  • Original title: Numerical optimization of the thermal performance of a microchannel heat sink.
  • Record ID : 2002-2859
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 13
  • Publication date: 2002/06

Links


See other articles in this issue (8)
See the source

Indexing