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Three-dimensional numerical optimization of a manifold microchannel heat sink.

Author(s) : RYU J. H., CHOI D. H., KIM S. J.

Type of article: Article

Summary

A three-dimensional analysis procedure for the thermal performance of a manifold microchannel heat sink has been developed and applied to optimize the heat-sink design. Compared with the comparable traditional microchannel heat sink, the thermal resistance is reduced by more than half while the temperature uniformity on the heated wall is improved tenfold. The optimal dimensions and corresponding thermal resistance have a power-law dependence on the pumping power.

Details

  • Original title: Three-dimensional numerical optimization of a manifold microchannel heat sink.
  • Record ID : 2004-0113
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 46 - n. 9
  • Publication date: 2003/04

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