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Thermodynamic optimization of cooling techniques for electronic packages.

Author(s) : BEJAN A., LEDEZMA G. A.

Type of article: Article

Summary

Five basic cooling configurations are optimized. It is shown that in forced air cooling above room temperature the fan power requirement is minimum when the heat transfer contact area is optimized to a value that is of the order of 100 times the value of flow cross-sectional area. In air cooling with natural updraft, the heat generation rate is maximum when the heat transfer contact area is of the order of 100 times the flow cross-sectional area. In forced convection cooling at cryogenic temperatures, the refrigerator power requirement has minima with respect to the cold-end (refrigeration load) temperature and the heat transfer contact area. The optimal heat transfer area is again of the order of 100 times the flow cross-sectional area.

Details

  • Original title: Thermodynamic optimization of cooling techniques for electronic packages.
  • Record ID : 1996-3734
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 39 - n. 6
  • Publication date: 1996/04

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