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IIR document
Study on material arrangement of multi-layered active magnetic regenerator with lanthanum compound materials.
Study on the configuration of multi-layered active magnetic regenerator with lanthanum compound materials for magnetic heat pump devices.
Accurate determination of the magnetocaloric parameters of LaFeCoSi compounds.
Substitutional and interstitial modulation of La-Fe-Si structure discussed with hydrogen sorption kinetics.
Effect of Nd-substitution on the magnetocaloric properties and 1:13-phase formation of sintered La(FeCoSi)13.
Recent developments in the production of (La, Ce)(Fe, Mn, Si)13Hx materials produced via gas atomization process.
Kinetics of the thermal decomposition reaction of (La,Nd)-(Fe,Co)-Si-C alloys.
Properties of La(Fe, Si)13 Magnetocaloric compounds prepared by reactive spark plasma sintering.
Pratical properties of LaFeCoSi materials to be used in magnetic cooling regenerators.
Combined effect of Co substitution and hydrogenation on La(Fe, Si)13 magnetocaloric properties.
Control of transition features by combining electronic-structure modification and magnetovolume effect in La(Fe, Si)13 based compounds.
Search for the magnetocaloric effect in multiferroics oxides.
Interstitial modification of La(Fe,Si)13 phase by acid solutions.
The effect of processing parameters on 1:13 phase formation and magnetic properties of (La1-xCex)(Fe1-YMny)11.5Si1.5Hz compounds.
Feasibility study of high frequency magnetic refrigeration cycle by fast response temperature measurement of magnetocaloric effect of La(Fe0.88Si0.12)13.
Refrigeration sector monitoring
2 results
A possible major step in the quest of room-temperature superconductivity
Two researcher teams have just reported experiments indicating that a hydride of lanthanum compressed to 1.7 to 1.85 million bar has a critical temperature of 250–260 K (-23 – -13°C).
New magnetic nanocooling technology decreases the environmental impact of cooling and avoids side effects of magnetic fields on electronics
Researchers from the University of Cambridge, UK, and CICnanoGUNE in Spain have developed new cooling technology for the thermal management of computer chips and other miniaturized devices. It utilizes materials that change temperature when...