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A uniform temperature heat sink for cooling electronic devices.

Author(s) : HETSRONI G., MOSYAK A., SEGAL Z., et al.

Type of article: Article

Summary

The objective is to keep the operating temperature at a relatively low level of about 323-333 K, using a dielectric liquid that boils at a lower temperature, while reducing the undesired temperature variation in the both streamwise and transverse directions. The experimental study is based on systematic measurements of temperature, flow and pressure, infrared radiometry and high-speed digital video imaging.

Details

  • Original title: A uniform temperature heat sink for cooling electronic devices.
  • Record ID : 2003-1189
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 45 - n. 16
  • Publication date: 2002/07

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