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Computations of liquid immersion cooling for a protruding heat source in a cubical enclosure.

Author(s) : WROBLEWSKI D. E., JOSHI Y.

Type of article: Article

Summary

Three-dimensional natural convection flow and heat transfer were studied numerically for a heated, protruding substrate-mounted chip or package in a cubic enclosure filled with a dielectric liquid. The governing steady-state equations for the natural convection within the liquid and the conjugate conduction within the element and the substrate were solved. Conduction through the substrate plays a dominant role in the cooling of the chip for values of substrate-to-fluid thermal conductivity ratios greater than 10. Comparison of the numerical results with experimental data showed reasonable agreement.

Details

  • Original title: Computations of liquid immersion cooling for a protruding heat source in a cubical enclosure.
  • Record ID : 1993-2529
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 36 - n. 5
  • Publication date: 1993/03

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