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COOLING TECHNOLOGY FOR ELECTRONIC COMPUTERS.

[In Japanese. / En japonais.]

Author(s) : NAKAYAMA W.

Type of article: Article

Summary

THE ARTICLE PRESENTS A REVIEW OF PUBLISHED DATA ON HEAT LOADS IN RECENT LARGE-SCALE JAPANESE COMPUTERS. A SURVEY HAS INDICATED THAT, SINCE 1980, HIGH LEVEL INTEGRATION OF MICRO-ELECTRONIC CIRCUITS HAS RESULTED IN AN ALMOST FOUR-FOLD INCREASE IN THE POWER DISSIPATION FROM LOGISTICAL CHIPS. FORCED CONVECTION AIR COOLING AND LIQUID COOLING COUPLED WITH THERMAL BRIDGES ARE DISCUSSED WITH REFERENCE TO DESIGNS EMPLOYED IN PRESENT-DAY COMPUTERS. MORE ADVANCED COOLING SCHEMES ARE ALSO DISCUSSED. THE IMPORTANCE OF THE THERMAL ENVIRONMENTAL CONTROL OF COMPUTER ROOMS IS EMPHASIZED.

Details

  • Original title: [In Japanese. / En japonais.]
  • Record ID : 1988-2024
  • Languages: Japanese
  • Source: Trans. JAR - vol. 4 - n. 2
  • Publication date: 1987
  • Document available for consultation in the library of the IIR headquarters only.

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