Share

CRYOPUMPING AND SUBSTRATE COOLING ATTACHMENTS TO A HIGH VACUUM THIN FILM COATING UNIT.

Author(s) : VASUDEVA RAO V.

Type of article: Article

Summary

PROBLEMS TO SOLVE FOR CONTAMINANT FREE FORMATION OF THIN FILMS: MAINTAINING OF HIGH VACUUM EVEN IN THE PRESENCE OF SUDDEN BURSTS OF VAPOUR DURING DEPOSITION OF THE FILMS, CONTROL OF THE PARTIAL PRESSURE OF DIFFERENT GASEOUS COMPONENTS, NECESSITY OF MAINTAINING THE SUBSTRATE AT DIFFERENT TEMPERATURES BOTH DURING FILM DEPOSITION AND MEASUREMENTS IN SITU. THE VACUUM CHAMBER FABRICATED AND TESTED BY THE AUTHORS FULFIL THESE CONDITIONS. THE CRYOPANEL USED AS PUMPING SURFACE IS COOLED BY CIRCULATING LIQUID NITROGEN, DOWN TO 80 K IN ABOUT FIVE MINUTES AND THE VACUUM IS THEN OBSERVED TO DECREASE FROM 0.06 M TORR TO ABOUT 6 MICRO TORR. USING THIS ATTACHMENT, A FILM OF BISMUTH WAS DEPOSITED ON A GLASS SUBSTRATE AT ABOUT 155 K AND ITS ELECTRICAL RESISTANCE WAS MEASURED DURING TWO CYCLES OF COOL-DOWN AND WARM-UP. J. V.

Details

  • Original title: CRYOPUMPING AND SUBSTRATE COOLING ATTACHMENTS TO A HIGH VACUUM THIN FILM COATING UNIT.
  • Record ID : 1982-1841
  • Languages: English
  • Source: Indian J. Cryog. - vol. 5 - n. 3
  • Publication date: 1980
  • Document available for consultation in the library of the IIR headquarters only.

Links


See other articles in this issue (4)
See the source

Indexing