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Design optimization of a spreader heat sink for power electronics.

Author(s) : MARANZANA G., PERRY I., MAILLET D., et al.

Type of article: Article

Summary

This article deals with a design method for optimizing heat spreaders dedicated to electronic board cooling. The modelling is based on the thermal quadruple method which is an analytical exact and rapid method that can be implemented for suitable geometries. Under some conditions, an optimal thickness can be found for the spreader (or the heat sink base). It corresponds to a minimization of the average or the maximal temperature of the heat sources. This optimal thickness is given in a non-dimensional form by an abacus which can be used in a quantitative way to design heat spreaders or, in a more qualitative way, to assess the function and the performance of the spreader. Locations of the sources on the heat spreader as well as the shape of the spreader are also optimized. Finally, the case of a pyramidal multi-layer heat spreader is considered in order to test the efficiency of the quadruple method as a tool for modelling conductive heat transfer for optimization applications.

Details

  • Original title: Design optimization of a spreader heat sink for power electronics.
  • Record ID : 2004-1956
  • Languages: English
  • Source: International Journal of thermal Sciences - vol. 43 - n. 1
  • Publication date: 2004/01

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