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Electronic cooling: silicon micro heat pipes.

Refroidissement électronique : microcaloducs en silicium.

Author(s) : LAUNAY S., LE BERRE M., SARTRE V., et al.

Type of article: Article

Summary

In this study, micro heat pipe arrays etched into silicon wafers were investigated, for electronic cooling purposes. Micro heat pipes of triangular cross-section (230 micro-m width) and with liquid arteries were fabricated by wet anisotropic etching in a KOH solution. The microchannels were closed by molecular bonding of a plain wafer with the grooved one. Two test benches were developed for the micro heat pipe filling and thermal characterisation. The temperature profile at the silicon surface was deduced from experimental measurements and a 3D numerical simulation. The results have shown that with the artery micro heat pipe array, the effective thermal conductivity of the silicon wafer was improved by 330%.

Details

  • Original title: Refroidissement électronique : microcaloducs en silicium.
  • Record ID : 2004-2506
  • Languages: French
  • Source: Rev. gén. Froid - vol. 94 - n. 1041
  • Publication date: 2004/03
  • Document available for consultation in the library of the IIR headquarters only.

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