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Experimental study on silicon micro-heat pipe arrays.

Author(s) : LAUNAY S., SARTRE V., LALLEMAND M.

Type of article: Article

Summary

In the study, micro-heat pipe arrays etched into silicon wafers have been investigated for electronic cooling purposes. Micro-heat pipes of triangular cross-section and with liquid arteries were fabricated by wet anisotropic etching with a KOH solution. The microchannels (230 µm wide) are closed by molecular bonding of a plain wafer with the grooved one. A test bench was developed for the micro-heat pipe filling and the thermal characterisation. The temperature profile on the silicon surface is deduced from experimental measurements. The results show that with the artery micro-heat pipe array, filled with methanol, the effective thermal conductivity of the silicon wafer is significantly improved compared to massive silicon.

Details

  • Original title: Experimental study on silicon micro-heat pipe arrays.
  • Record ID : 2004-2172
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 24 - n. 2-3
  • Publication date: 2004/02

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