Share

Enhanced boiling heat transfer in porous layers with application to microchip cooling.

Author(s) : STUBOS A. K., KONSTANTINOU N. D., KANELLOPOULOS N. K., PAPAIOANNOU A.

Summary

The present contribution deals with a continuous approach to modelling steady state evaporative heat transfer and vapour/liquid counterflow in porous media, in an attempt to identify the mechanisms responsible for the observed heat transfer enhancement during boiling of liquid coolants in porous layers. A simplified analytical approach is taken simulating the steady state thermohydraulic behaviour of a liquid saturated porous medium heated from the bottom or volumetrically. This gives a fast, approximate method for predicting the limiting dryout heat flux in the porous layer. Based on the understanding gained, suggestions are made for significant increase of the heat flux removed in the case of electronic components cooling.

Details

  • Original title: Enhanced boiling heat transfer in porous layers with application to microchip cooling.
  • Record ID : 1997-0751
  • Languages: English
  • Source: Proceedings of the 2nd European Thermal-Sciences (EUROTHERM) and 14th UIT National Heat Transfer Conference 1996.
  • Publication date: 1996/05/29
  • Document available for consultation in the library of the IIR headquarters only.

Links


See other articles from the proceedings (69)
See the conference proceedings

Indexing