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Evaporative cooling due to a gently deposited droplet.

Author(s) : DI MARZO M., TARTARINI P., LIAO Y., EVANS D., BAUM H.

Type of article: Article

Summary

A coupled model that solves simultaneously the transient conduction equation for the solid and the liquid to yield the surface temperature and heat flux distributions as well as the description of the droplet transient evaporation is proposed. The predictions of the evaporation time are compared with experimental data. An additional model is presented which assumes constant heat flux at the liquid-solid interface. This model provides a closed form solution for the solid surface transient temperature distribution.

Details

  • Original title: Evaporative cooling due to a gently deposited droplet.
  • Record ID : 1994-1496
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 36 - n. 17
  • Publication date: 1993/11

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