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Evaporative modelling in a thin-film region of a microchannel.

Author(s) : PARK K., NOH K. J., LEE K. S.

Summary

A mathematical model which can predict the flow and heat transfer characteristics for evaporating a thin film region in a microchannel is presented and an analytical investigation is performed by using the presented model. For the formulation of modelling, the flow of the vapour phase and the shear stress at the liquid-vapour interface are considered. In addition, the disjoining pressure and the capillary force which drive the liquid flow at the liquid-vapour interface in thin film region are adopted. Comparing the magnitude of capillary and disjoining pressures, the length of the thin film region can be calculated. Results show that the influence of variation of vapour pressure on the liquid film flow is not negligible. It is also found that as the heat flux increases, the length of the thin film region and the film thickness decrease and the local evaporative mass flux increases linearly.

Details

  • Original title: Evaporative modelling in a thin-film region of a microchannel.
  • Record ID : 2003-1193
  • Languages: English
  • Source: 2002 Purdue conferences. 2002 compressor engineering & refrigeration and air conditioning conferences at Purdue [CD-ROM].
  • Publication date: 2002/07/16
  • Document available for consultation in the library of the IIR headquarters only.

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