ShareLiquid metal cooling for microelectronics.
Author(s) : POPESCU A., WELTY J. R., PANAITE C. E.
Type of article: Article
Summary
The paper presents some aspects related to usage of liquid metals and alloys as coolants for microelectronics. Micro-heat-sinks and liquid cooling become, again, potential options in electronics industry, due to their capacity of removing increased heat fluxes generated in electronics components.
Details
- Original title: Liquid metal cooling for microelectronics.
- Record ID : 30009970
- Languages: English
- Source: Buletinul Institutului politehnic din Iasi, Sectia Constructii de Masini - vol. 59 - n. 1
- Publication date: 2013
Links
See the source
Indexing
-
Themes:
Heat transfer;
Other industrial applications - Keywords: Electronics; Metal; Liquid; Heat transfer; Cooling; Microcomputer; Secondary refrigerant
-
Analysis of a platform for thermal management s...
- Author(s) : TIGNER J., MOEINI SEDEH M., SHARPE T., et al.
- Date : 2013/10
- Languages : English
- Source: Applied Thermal Engineering - vol. 60 - n. 1-2
View record
-
Investigation of self-similar heat sinks for li...
- Author(s) : BRIGHENTI F., KAMARUZAMAN N., BRANDNER J. J.
- Date : 2013/09
- Languages : English
- Source: Applied Thermal Engineering - vol. 59 - n. 1-2
View record
-
Convective performance of nanofluids in commerc...
- Author(s) : ROBERTS N. A., WALKER D. G.
- Date : 2010/11
- Languages : English
- Source: Applied Thermal Engineering - vol. 30 - n. 16
View record
-
A liquid-based system for CPU cooling implement...
- Author(s) : MADER G., THYBO C.
- Date : 2012/06
- Languages : English
- Source: Applied Thermal Engineering - vol. 39
View record
-
Passive cooling analysis of an electronic chips...
- Author(s) : HASSAN F., HUSSAIN A., JAMIL F., ARSHAD A., ALI H. M.
- Date : 2022/11
- Languages : English
- Source: Energies - vol. 15 - n. 22
- Formats : PDF
View record