Liquid metal cooling for microelectronics.

Author(s) : POPESCU A., WELTY J. R., PANAITE C. E.

Type of article: Article

Summary

The paper presents some aspects related to usage of liquid metals and alloys as coolants for microelectronics. Micro-heat-sinks and liquid cooling become, again, potential options in electronics industry, due to their capacity of removing increased heat fluxes generated in electronics components.

Details

  • Original title: Liquid metal cooling for microelectronics.
  • Record ID : 30009970
  • Languages: English
  • Source: Buletinul Institutului politehnic din Iasi, Sectia Constructii de Masini - vol. 59 - n. 1
  • Publication date: 2013

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