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Loop heat pipe for cooling of high-power electronic components.

Author(s) : VASILIEV L., LOSSOUARN D., ROMESTANT C., et al.

Type of article: Article

Summary

In this paper, we present a new development of loop heat pipe (LHP) technology in its applications to cooling systems for high-power IGBT elements. An advanced method of LHP evaporator wick manufacturing has been proposed. Following this approach, a 16 mm outer diameter and 280 mm-length LHP evaporator was designed and manufactured. Nickel and titanium particles were used as raw material in LHP evaporator wick fabrication. LHP with a nominal capacity as high as 900 W for steady-state condition and more than 900 W for a periodic mode of operation at a temperature level below 100°C and a heat transfer distance of 1.5 m was designed through the cooling of a high-power electronic module. An experimental program was developed to execute LHP performance tests and monitor its operability over a span of time. An investigation of the effects of LHP performance of parameters such as evaporator and condenser temperatures and LHP orientation in a gravity field was brought about. As regards the results of this initial series of tests, it was found that LHP spatial orientation within the nominal range of heat loads has no drastic effect on overall LHP functioning, whereas condenser temperature does play an important role, especially in the range of heat load close to critical. A 2D nodal model of the evaporator was developed and provides us with confirmation of the suggestion that when high-power dissipation levels are available, low wick conductivity is well adapted for LHP applications. [Reprinted with permission from Elsevier. Copyright, 2008].

Details

  • Original title: Loop heat pipe for cooling of high-power electronic components.
  • Record ID : 2009-1051
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 52 - n. 1-2
  • Publication date: 2009/01

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