Investigation of a wire plate micro heat pipe array.
Author(s) : LAUNAY S., SARTRE V., MANTELLI M. B. H., et al.
Type of article: Article
Summary
This article describes experimental and theoretical investigations conducted on a copper/water wire plate micro heat pipe (MHP). The experimental results show that its effective thermal conductivity was improved by a factor of 1.3 as compared to the empty MHP array. A numerical model was used to predict the fluid distribution along the MHP axis, the temperature field and the maximum heat flux corresponding to the MHP capillary limit. The 1D, steady-state hydrodynamic model is based on the conservation equations for the liquid and vapour phases. The wall temperatures were calculated from the thermal resistance network of the wall and the liquid film. Good agreement between the theoretical and experimental data was achieved. The effect of various parameters (contact angle, fluid type, corner angle and fill charge), was theoretically investigated.
Details
- Original title: Investigation of a wire plate micro heat pipe array.
- Record ID : 2004-2747
- Languages: English
- Source: International Journal of thermal Sciences - vol. 43 - n. 5
- Publication date: 2004/05
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Indexing
- Themes: Heat transfer
- Keywords: Heat pipe; Electronics; Copper; Design; Cooling; Plate; Wire; Expérimentation; Component
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