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Silicon microchannel cooling for high power chips.

Author(s) : COLGAN E. G., FURMAN B., GAYNES M., et al.

Type of article: Article

Summary

In this work, single-phase Si microchannel have been designed and characterized for cooling very high power density chips in single-chip modules (SCMs) in a laboratory environment.

Details

  • Original title: Silicon microchannel cooling for high power chips.
  • Record ID : 2007-0878
  • Languages: English
  • Source: HVAC&R Research - vol. 12 - n. 4
  • Publication date: 2006/12

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