ShareSilicon microchannel cooling for high power chips.
Author(s) : COLGAN E. G., FURMAN B., GAYNES M., et al.
Type of article: Article
Summary
In this work, single-phase Si microchannel have been designed and characterized for cooling very high power density chips in single-chip modules (SCMs) in a laboratory environment.
Details
- Original title: Silicon microchannel cooling for high power chips.
- Record ID : 2007-0878
- Languages: English
- Source: HVAC&R Research - vol. 12 - n. 4
- Publication date: 2006/12
Links
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Indexing
- Themes: Air conditioning in laboratories and industry
- Keywords: Electronics; Calculation; Microchannel; Heat transfer; Cooling; Component
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Refrigerated cooling of microprocessors with mi...
- Author(s) : THOME J. R., BRUCH A.
- Date : 2008
- Languages : English
- Source: The Institute of Refrigeration: annual proceedings. Volume 105, 2008-2009.
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A closed-loop electronics cooling by implementi...
- Author(s) : BINTORO J. S., AKBARZADEH A., MOCHIZUKI M.
- Date : 2005/12
- Languages : English
- Source: Applied Thermal Engineering - vol. 25 - n. 17-18
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Mixed convection in rectangular cavities at var...
- Author(s) : GUO G., SHARIF M. A. R.
- Date : 2004/05
- Languages : English
- Source: International Journal of thermal Sciences - vol. 43 - n. 5
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HVAC issues for data centres.
- Author(s) : PATTERSON M. K., STEINBRECHER R., MONTGOMERY S., et al.
- Date : 2005/04
- Languages : English
- Source: ASHRAE Journal - vol. 47 - n. 4
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Performance analysis of a miniature-scale vapou...
- Author(s) : TRUTASSANAWIN S., CREMASCHI L., GROLL E. A., et al.
- Date : 2006/07/17
- Languages : English
- Source: 2006 Purdue Conferences. 18th International Compressor Engineering Conference at Purdue & 11th International Refrigeration and Air-Conditioning Conference at Purdue [CD-ROM].
- Formats : PDF
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