IIR document
Cooling of microprocessors with micro-evaporation: a novel two-phase cooling cycle.
Author(s) : MARCINICHEN J. B., THOME J. R., MICHEL B.
Type of article: Article, IJR article
Summary
Three micro-evaporator cooling cycles, one with a pump, one with a compressor and a hybrid of the two together, are proposed for cooling a computer blade server. The hybrid cycle is characterized by the interchangeability between the first two cycles, where the decision on the cycle to operate is based on the season (necessity or economical benefit for heat recovery) or the maintenance of cycle's driver. The main characteristics of each cycle are presented as well as the details of the micro-evaporator cooler for the blade's CPU. Analysis of the cycle overall efficiency and the potential for heat recovery shows that the best cycle to use depends mainly on the end application of the heat recovered. Four refrigerants were evaluated as the possible working fluids for cooling the microprocessors. HFC-134a and HFC-245fa were found to be the best choices for the desired application.
Available documents
Format PDF
Pages: pp. 1264-1276
Available
Public price
20 €
Member price*
Free
* Best rate depending on membership category (see the detailed benefits of individual and corporate memberships).
Details
- Original title: Cooling of microprocessors with micro-evaporation: a novel two-phase cooling cycle.
- Record ID : 2010-1278
- Languages: English
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 33 - n. 7
- Publication date: 2010/11
Links
See other articles in this issue (24)
See the source
Indexing
- Themes: Air conditioning in laboratories and industry
- Keywords: Refrigerating circuit; Electronics; Computer; Comparison; Design; Cooling; Heat recovery; COP; Component
-
Airflow management in a liquid-cooled data center.
- Author(s) : CADER T., WESTRA L., REGIMBAL K., et al.
- Date : 2006/06/25
- Languages : English
- Source: ASHRAE Transactions. 2006 Annual Meeting, Quebec City, Canada. Volume 112, part 2 + CD-ROM.
View record
-
COOLING OF ELECTRONIC MODULES IN 19 INCH EQUIPM...
- Author(s) : MAZURA P.
- Date : 1990
- Languages : German
- Source: Klima Kälte Heiz. - vol. 18 - n. 5
View record
-
Liquid cooling architectures for computer syste...
- Author(s) : ELLSWORTH M. J., SCHMIDT R. R.
- Date : 2007/06/23
- Languages : English
- Source: ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
View record
-
HVAC issues for data centres.
- Author(s) : PATTERSON M. K., STEINBRECHER R., MONTGOMERY S., et al.
- Date : 2005/04
- Languages : English
- Source: ASHRAE Journal - vol. 47 - n. 4
View record
-
COOLING TECHNOLOGY FOR ELECTRONIC COMPUTERS.
- Author(s) : NAKAYAMA W.
- Date : 1987
- Languages : Japanese
- Source: Trans. JAR - vol. 4 - n. 2
View record