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Study on heat transfer enhancement of lotus-type porous copper heat sink.

[In Chinese. / En chinois.]

Author(s) : WU J., LIU Y., LI Y., et al.

Type of article: Article

Summary

Lotus-type porous copper is a new kind of microchannel structure with long cylindrical pores aligned in one direction. It can be used as a heal sink for cooling of high-power electronic components. Through experimental and numerical simulations with Flow Simulation, the heal transfer performance of a lotus-type porous copper heal sink with uniform distributed micro-groove was systematically studied. The experimental results showed that this kind of heat sink has an excellent heat transfer coefficient, as high as 10. 1 W/(cm2 • K), only under a flow rate as low as 110mL/s. The simulation showed that optimal number and angle of micro-groove existed for the heat sink to reach a maximal equivalent heat transfer coefficient. For water as its coolant, the optimal number and angle of micro-groove were 7-11 and 450, respectively. And heal transfer performance of the heat sink continuously improved with decreasing of the width of micro-groove. The numerical simulation results were compared with the experimental results, and the reasons for the differences were analyzed.

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Pages: 94-99

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