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Study on two microchannel coolers with different coupling mechanisms of distributed J-T effect and heat transfer.

Author(s) : CHANG Z., CUI X., SHE H., GENG H.

Type of article: IJR article

Summary

As a typical characteristic of the microchannel Joule-Thomson (J-T) coolers, the distributed J-T effect significantly impacts the cooling effect. To investigate the coupling mechanism of distributed J-T effect and heat transfer, two micro-coolers are fabricated by Printed Circuit Board (PCB) technology in this study. The throttling device is removed from the micro-cooler with staggered etched pillars (Cooler-Pillars), resulting in an entire coupling of heat recovery and throttling processes. The heat recovery and throttling structures are preserved in a micro-cooler etched with rectangular microchannels (Cooler-REC), and the two processes couple partly. The performance of the two micro-coolers is investigated experimentally and numerically at the inlet pressure of 2.02∼5.12 MPa. The experimental results show that the mass flow rate and total pressure drop of Cooler-Pillars are higher than Cooler-REC at the same inlet pressure. Compared with Cooler-REC, Cooler-Pillars can reach a lower cold end temperature and has a cold-end temperature of 190.6 K in steady-state operation at 5.03 MPa. A steady-state mathematical model is developed and compared favorably with the experimental results. The simulation result shows that at the same inlet pressure, the overall distribution of J-T coefficients and the total temperature drop caused by distributed J-T effect of Cooler-Pillars are higher. It is also found that the overall Nu distribution of Cooler-Pillars is higher than Cooler-REC, and heat transfer is enhanced, leading to an increase of 64.5% in average unit heat transfer at 5 MPa.

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Pages: 397-406

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Details

  • Original title: Study on two microchannel coolers with different coupling mechanisms of distributed J-T effect and heat transfer.
  • Record ID : 30030826
  • Languages: English
  • Subject: Technology
  • Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 145
  • Publication date: 2023/01
  • DOI: http://dx.doi.org/10.1016/j.ijrefrig.2022.08.028

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