ShareThermal conductance of copper-cyanoacrylate adhesive YBCO joints between 5 and 300 K.
Author(s) : WENDLING N., CHAUSSY J., MAZUER J., ODIN J.
Type of article: Article
Summary
The authors have measured the thermal conductance per unit area of joints made of cyanoacrylayte adhesive between a copper block and various YBCO samples. Below 70 K, the thermal resistance is mainly due to the interfaces between materials. A rough estimate of the bulk thermal conductivity in the high-temperature range leads to the value of 0.3 W/m.K, ie, of the same order of magnitude as for other adhesives commonly used in low temperature experimental physics.
Details
- Original title: Thermal conductance of copper-cyanoacrylate adhesive YBCO joints between 5 and 300 K.
- Record ID : 1994-3366
- Languages: English
- Source: Cryogenics - vol. 34 - n. 1
- Publication date: 1994/01
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