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IIR document

Thermal cooling multichip ultra high power LED using refrigeration cycle system.

Number: pap. n. 66

Author(s) : HSU C. N., WANG W. C.

Summary

In solid-state light-emitting diode (LED), the process technology is enhanced, lighting brightness performance per power is improved, and optical performance is increased. However, the LED chip junction temperature, Tj, is still a disadvantage in critically high hot spots and high temperatures. These disadvantages can shorten life and reduce efficiency. Therefore, Tj must also be solved. From a single-crystal silicon chip packaging LED to multichip packaging LED, this tool has become the most mainstream item in the market development of high brightness. Therefore, investigating the research approach and techniques needed to solve the high temperature Tj is necessary. In this study, the system used an environmental protection refrigerant as R407C and R134a systems for a thermal cooling temperature and constant-flow compression refrigeration cycle system that cool ultra highpower multichip and high brightness gallium indium nitride (InGaN) LED heat source. To reduce the LED chip, Tj temperature needs to reach the following specifications: < 125°C to max. 150°C and Tcase < 50°C to max. 85°C.

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Details

  • Original title: Thermal cooling multichip ultra high power LED using refrigeration cycle system.
  • Record ID : 30015103
  • Languages: English
  • Source: Proceedings of the 24th IIR International Congress of Refrigeration: Yokohama, Japan, August 16-22, 2015.
  • Publication date: 2015/08/16
  • DOI: http://dx.doi.org/10.18462/iir.icr.2015.0066

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