USE OF INDIUM SOLDER TO PATCH LEAKS IN SILVER-SOLDER JOINTS ON CRYOSTATS.

Author(s) : HOLTZ R. L., SWENSON C. A.

Type of article: Article

Summary

INDIUM METAL AS A SOLDER CAN PROVIDE A CONVENIENT AND EFFECTIVE, LAST RESORT, PATCHING MATERIAL FOR LEAKS WHICH OCCUR SPONTANEOUSLY IN METALLIC LOW-TEMPERATURE APPARATUS. INDIUM BONDS WELL TO MANY METALS AND, MORE IMPORTANTLY, REMAINS DUCTILE TO 4 K. AN INDIUM PATCH THEREFORE RETAINS ITS INTEGRITY EVEN WHERE A LEAK HAS OCCURRED DUE TO THE DIFFERENTIAL THERMAL EXPANSIONS OF CONSTRUCTION MATERIALS.

Details

  • Original title: USE OF INDIUM SOLDER TO PATCH LEAKS IN SILVER-SOLDER JOINTS ON CRYOSTATS.
  • Record ID : 1985-1812
  • Languages: English
  • Source: Rev. sci. Instrum. - vol. 56 - n. 2
  • Publication date: 1985
  • Document available for consultation in the library of the IIR headquarters only.

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