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A review on flow boiling enhancement on textured surfaces.

Author(s) : MERTENS F., CASTAGNE S., VETRANO M. R.

Type of article: Periodical article, Review

Summary

It is widely established that flow boiling, being a direct cooling technique also employing the latent heat of the fluid, has the potential to be more efficient than being useful in single-phase conventional cooling methods. This results in considerable potential for thermal management in many fields like microelectronics, space technology, thermal power plants, etc. The increasing demand for heat dissipation, consequent to component miniaturization, has pushed the development of new strategies for enhancing heat transfer efficiency, such as employment of functionalized surfaces. This review aims to describe in detail the current status of technology related to flow boiling heat transfer enhancement via micro/nanoscale surface functionalization. Key objectives are an increased nucleation site density and enhanced bubble dynamics. The vast majority of findings show favorable heat transfer performance, evidenced by an earlier onset of boiling (ONB), an improved flow boiling heat transfer coefficient (HTC), and an ameliorated critical heat flux (CHF). Increased pressure drop is a serious concern in certain application cases. Nanoscale textures mainly enhance capillary wicking to nucleation sites, thus being more effective in combination with microscale textures that define fixed nucleation sites. Degradation effects need to be more thoroughly and systematically characterized for application cases. Extra effects related to the manufacturing process can be easily overlooked, but one should be aware of their possible existence when drawing conclusions. Finally, the implementation of enhanced surfaces in mainstream applications is hindered by the absence of general predictive design tools for different channel configurations/materials, fluids, and operating conditions. A more universal understanding of the basic mechanisms involving texture geometry is needed in this aspect.

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Pages: 29 p.

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