IIR document
Active control of ice adhesion force to copper surface by varying surfactant concentrations.
Author(s) : MATSUMOTO K., MINAMIYA K., KUBOTA H.
Type of article: Article, IJR article
Summary
Adhesion of ice to a solid surface has been investigated by many researchers including one of authors. While, authors group clarified that it was possible to actively control a supercooling degree due to adsorption of surfactant molecules to a solid surface by varying surfactant concentrations. In this study, control of the ice adhesion force through the adsorption to a copper surface and its active control by varying surfactant concentrations are investigated.A surfactant-pure water mixture is frozen on a copper surface at a fixed surface temperature, and the adhesion forces are measured by a SPM, varying surfactant concentrations. While, the amounts of surfactant adsorbed to a copper surface are also measured by a QCM, varying surfactant concentrations. The possibility of active control of the adhesion force is evaluated based on the relationship between the ice adhesion force and the amount of adsorbed surfactant.
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Pages: 252-260
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Details
- Original title: Active control of ice adhesion force to copper surface by varying surfactant concentrations.
- Record ID : 30022246
- Languages: English
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 76
- Publication date: 2017/04
- DOI: http://dx.doi.org/10.1016/j.ijrefrig.2017.02.013
Links
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Indexing
- Themes: Thermodynamic measurements
- Keywords: Surfactant; Ice; Copper; Measurement; Adsorption; Adhesion; Microscopy
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- Formats : PDF
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- Formats : PDF
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Active control of supercooling degree using sur...
- Author(s) : MATSUMOTO K., SHIRAI D., FURUDATE Y., et al.
- Date : 2015/10
- Languages : English
- Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 58
- Formats : PDF
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Influences of number of hydroxyl groups and coo...
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A variable temperature scanning tunneling micro...
- Author(s) : WOLKOW R. A.
- Date : 1992/09
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- Source: Rev. sci. Instrum. - vol. 63 - n. 9
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